Several independent reports say Chinese researchers in Shenzhen have completed and are testing a prototype EUV lithography machine that uses expertise from former ASML engineers and repurposed parts from older ASML tools. The system reportedly generates stable EUV light, which is the core prerequisite for advanced chipmaking, but it has not yet been used to complete a full chip production flow, so China is still at the demonstrator stage rather than true high volume manufacturing. Timelines suggested in industry commentary range from around 2028 to 2030 for meaningful domestic EUV production, assuming China can industrialize the technology, build reliable sources, optics and resists, and solve throughput and yield issues at scale.
By that time, TSMC, Samsung and Intel are expected to be deep into high NA EUV and possibly early post EUV options, which means China is closing the gap but will likely remain several nodes behind the cutting edge. The United States stays ahead through ecosystem control and export rules, while Europe’s influence is concentrated in ASML and a few suppliers instead of a full AI chip stack.
